With so many technological advances around, it's hard to believe that some industries still use outdated manual processes to carry out crucial and sometimes life-dependent tasks such as transporting ...

A major development in laptop cooling technology is set to debut at CES 2025. Ventiva, a leader in thermal management solutions, will unveil its innovative solid-state cooling system, which uses ...

A research team has bridged a knowledge gap in atomic-scale heat motion. This new understanding holds promise for enhancing materials to advance an emerging technology called solid-state cooling. A ...

A company that makes tiny, solid state speakers is adapting its technology to make a solid-state cooling chip for smartphones, tablets, and other small electronic devices. The xMEMS XMC-2400 µCooling ...

As the data center industry continues to advance, effectively managing heat has become even more crucial for achieving ideal performance, extending equipment longevity, and reducing operational costs.

OAK RIDGE, Tenn. — A team of researchers led by the Oak Ridge National Laboratory helped advance the development of solid-state cooling technology, which they said has the potential to provide ...

Several companies and research teams are in the process of commercializing solid-state cooling technologies. Once several technical challenges are overcome, the technology is expected to provide a ...

At the technological inflection point where the global new energy vehicle industry is evolving from "quantity" to "quality" ...

Liquid cooling will likely be needed for SSDs that provide the performance needed for future AI data center workloads. Solidigm was demonstrating and talking about a prototype liquid cooled SSD at the ...

Powerful electronic gear helps you get things done faster, but as power goes up, so does heat. That's a big problem with fully enclosed devices like phones and portable storage. Solid-state drives ...

The NVIDIA Jetson Orin Nano Super is a $249 AI development kit that combines an NVIDIA system-on-a-module with a carrier board to create a palm-sized computer with up to 67 TOPS of AI performance.