In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH. This strategic integration unites Kurtz ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

Written by Dr. Pradyumna (Prady) Gupta, Founder & CEO of Infinita Lab and Infinita Materials. As electronic devices and EV systems continue to push the boundaries of power density and miniaturization, ...

Power electronics packaging is experiencing new trends as a result of the needs of high power applications, with automotive market being a strong driver. The continuous electrification of functions in ...

Samsung Electronics (OTCPK:SSNLF) is planning to reorganize its supply chain for advanced semiconductor packaging, South Korean media outlet ETNews reported on Thursday, citing industry sources. The ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced ...

The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...

Dr. Chidinma Chimara Imediegwu, a Nigerian engineer trained in the United States, has completed doctoral research with clear relevance to Nigeria’s transport, energy, and industrial sectors. She ...