With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
Qualcomm and MediaTek have expressed willingness to tap into India’s emerging fabrication and chip packaging capacities if ...
This article was originally published on ARPU. View the original post here. In a prominently placed interview with China's state newspaper, Huawei founder Ren Zhengfei sent a clear message to ...
The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...
TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry is entering a ...
The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...
Amtech Systems (ASYS) and Lam Research Corporation (LRCX) operate at the core of the semiconductor ecosystem. While Lam Research supplies the advanced machines used to build chips, especially for ...
On Tuesday, Applied Materials, Inc. (NASDAQ:AMAT) announced it had purchased a 9% stake in BE Semiconductor Industries (Besi), a manufacturer of assembly equipment for the semiconductor industry. The ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
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