The company said Cadence ChipStack AI Super Agent will help revolutionize how engineers automate chip design by improving ...

M5 Pro, M5 Max: What I Expect from Apple's Next-Gen Chips ...

Lasers that are fabricated directly onto silicon photonic chips offer several advantages over external laser sources, such as greater scalability. Furthermore, photonic chips with these ...

A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...

State Key Laboratory of Integrated Chip and System, Fudan University has the following research output in the current window (1 November 2024 - 31 October 2025) of the Nature Index. Click on Count to ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces.

Alibaba is steadily building a vertically integrated chip ecosystem that spans cloud computing, AI chip design, and advanced packaging. People's Daily recently ...

Advancements in photonic integration demand high-speed, precise dynamic light field control and large-capacity information processing capability. As subwavelength artificial structures, metasurfaces ...

The industry's first chip-scale packaging technology designed for highly integrated RF modules, the Pyxis platform promises reductions in cost, height, and area of 50%, 60%, and 75%, respectively, ...

The study by the researchers of the Department of Electronics, Information and Bioengineering – DEIB published in Nature Electronics The device uses two 64×64 arrays of programmable resistive memories ...