The W3E32M64S-XSBX, a 32-Mword by 64-bit double-data-rate (DDR) SDRAM module, packs 256 Mbytes of storage in a single 208-contact plastic ball-grid-array (BGA) package that measures 13 by 22 by 2.11 ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first NVMe* PCIe ...
Intel’s BGA processors are definitely going to become a bigger part of Intel’s portfolio in the future and by the looks of things these BGA packages are mainly designed to transform the bottom segment ...
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