A practical workshop to assist engineers using land grid array and quad flat no lead devices in the design and assembly of their products. St Albans LGAs and QFNs have become increasingly common ...

Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include QFN, BGA, SOIC, QFP, LGA, WLCSP and ...

Synergetix' miniature 0.4-mm test socket probe is available for all major package types, including BGA, LGA, QFN, and QFP. Tip options include a four-point crown, concave, and 120 single point. A ...

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

EAGAN, MN and MIAMI, FL / ACCESSWIRE / September 1, 2022 / HEICO Corporation (NYSE:HEI.A and HEI.A) today announced that its Electronic Technologies Group acquired approximately 80% of the capital ...