Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how ...

Chipmakers are turning to glass substrates for AI packages, enabling larger and denser arrangements of chiplets and ...

As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry ...

The U.S. Advanced IC Substrates Market was worth USD 1.40 Billion in 2025 and is expected to reach approximately USD 2.94 ...

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A specialized glass layer could make tomorrow’s computers faster and more energy efficient. Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, ...