New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...

One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate ...

Assuming position as one of the largest, full-pattern-capable, open-top sockets available, the 3M Textool brand Type IV, 0.8-mm, open-top BGA test and burn-in socket now accepts packages on a 0.8-mm ...

Mobile processors these days don't come with sockets like desktop CPUs, but they're still manufactured for a specific package type. The package for AMD's "Phoenix" and "Hawk Point" processors is ...

Types of lead-frame packages must also be considered since they normally do not incorporate return planes. If a lead-frame package is next to a BGA, a power supply return path needs to be designed ...