LG Innotek will also unveil two new Nexlide products: Nexlide Edge, which has been made slimmer by replacing the LED packages with LED chips, and Nexlide Vision, which combines Pixel Lighting and ...

This is due to the limitations of processing vast amounts of data with existing semiconductor chips based on electronic circuit boards (PCBs). The vehicle AP module developed by LG Innotek.

Seoul: LG Innotek, South Korea’s leading camera module maker, has started the mass production of flip-chip ball-grid array (FC-BGA) substrates, the high-end chip substrates for servers and data ...

LG Innotek is planning to grow its semiconductor components business to 3 billion dollars in annual sales by 2030, largely based on high-value semiconductor substrates such as FC-BGA(Flip-Chip ...

LG Innotek announced on the 12th that it ... such as "Slide Edge," which has become thinner by replacing LED packages with LED chips, and "Nexslide Vision," which combines pixel lighting ...

In contrast, "LG Innotek's RGB-IR In-Cabin camera module" can perform various ... Wedge bonding is a technology that uses ultrasonic energy to attach chips and substrates. In the past, the chips used ...

SEOUL, South Korea, Feb. 19, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on February 19 that it will participate in the 34th Lighting Workshop organized by Driving Vision News(DVN ...