Abstract: This paper explores the possibility of the S0 (zeroth-order symmetric Lamb mode)-like SAW mode in the LiNbO3/SiO2/Sapphire configuration. The maximum velocity of slow shear wave was found on ...
Three-dimensional (3D) packaging technology is currently considered the preferred solution beyond Moore’s law, while the through silicon via (TSV) technology is the core of 3D packaging technology.
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