TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare ...

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly.

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and advanced debug.

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Improved Package Internal Connections: Instead of traditional aluminum wedge bond, utilizing aluminum ribbon bonds, copper ...

We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrication techniques that provide precise ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes them an integral part of any neural network, but nonlinear functions can ...

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization ...

Moving data through a chip or package, and between packages and systems, is becoming a much bigger challenge as the volume of data continues to explode, and as more compute resources are deployed to ...