OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

binder is strategically expanding its connector portfolio to address the needs of rail and transport applications ...

EnSilica awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (C-LEO) programme.

The Agilex eSOM7 Apollo MxFE Development Platform with the eSOM7-2F (2x F-tile) is available for order now through Hitek ...

BOW, the universal robotics software company, has successfully closed a £4 million seed round.

Silicon Labs has introduced two new SoCs, the BG22L and BG24L, for Bluetooth LE connectivity, with the BG24L Bluetooth 6.0 ...

PseudolithIC, a US company specialising in RF (radio frequency) chipset products, has successfully raised $6 million.

Syslogic’s Rugged Computer RSA4NA unlocks new opportunities for generative AI models following a power upgrade.

Cambridge Sensoriis, a UK specialist in the development of radar technology, has expanded its portfolio with the introduction ...

Quantum Science, a developer of infrared QD technology, is expanding into a new state-of-the-art manufacturing facility.

Exein has announced a partnership agreement with MediaTek that it says will transform device security on a massive scale ...

The OPTIGA Connect Consumer OC1230’s security architecture is based on Arm v8 and Infineon’s Integrity Guard 32 technology ...