How to Solder bga componentS ? - RayPCB
raypcb.com
How to Solder bga componentS ? - RayPCB
Ball grid array (BGA) packages have arrays of solder ball connections instead of leads, enabling high density interconnection with printed circuit boards (PCBs). However, the lack of visible leads and solder connections under the package presents challenges for hand soldering or reworking BGAs. Specialized techniques and tools are required ...
Jul 27, 2019
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CPU reballing is a technique used to repair or replace the solder balls that connect a CPU (Central Processing Unit) to a motherboard, particularly in devices like laptops and smartphones where the CPU is directly soldered to the board (BGA, or Ball Grid Array). This process involves removing the old solder balls, cleaning the contact points, and then applying new solder balls, often using specialized tools and techniques. It's a repair method for issues like overheating, crashing, or other faul
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